MRF19045SR3
vs
MD7P19130HSR3
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
FLATPACK, R-CDFP-F2
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Additional Feature |
HIGH EFFICIENCY
|
|
Case Connection |
SOURCE
|
|
Configuration |
SINGLE
|
|
DS Breakdown Voltage-Min |
65 V
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
|
Highest Frequency Band |
L BAND
|
|
JESD-30 Code |
R-CDFP-F2
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Operating Mode |
ENHANCEMENT MODE
|
|
Operating Temperature-Max |
200 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLATPACK
|
|
Polarity/Channel Type |
N-CHANNEL
|
|
Power Dissipation-Max (Abs) |
105 W
|
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
YES
|
|
Terminal Form |
FLAT
|
|
Terminal Position |
DUAL
|
|
Transistor Application |
AMPLIFIER
|
|
Transistor Element Material |
SILICON
|
|
Base Number Matches |
3
|
3
|
HTS Code |
|
8541.29.00.75
|
Factory Lead Time |
|
4 Weeks
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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