MRF19030LR3
vs
MRF19030LSR3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Package Description
FLANGE MOUNT, R-CDFM-F2
FLATPACK, R-CDFP-F2
Pin Count
2
2
Manufacturer Package Code
CASE 465E-04
CASE 465F-04
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
5A991
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
65 V
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
L BAND
L BAND
JESD-30 Code
R-CDFM-F2
R-CDFP-F2
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
200 °C
200 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLATPACK
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
83.3 W
83.3 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Rohs Code
HTS Code
8542.31.00.01
JESD-609 Code
e4
Peak Reflow Temperature (Cel)
260
Terminal Finish
GOLD
Time@Peak Reflow Temperature-Max (s)
40
Compare MRF19030LR3 with alternatives
Compare MRF19030LSR3 with alternatives