MRF182S
vs
SD57030
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
STMICROELECTRONICS
Package Description
FLATPACK, R-CDFP-F2
0.360 X 0.230 INCH, ROHS COMPLIANT, PLASTIC, M243, 2 PIN
Pin Count
2
2
Manufacturer Package Code
CASE 360C-03
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
65 V
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
ULTRA HIGH FREQUENCY BAND
ULTRA HIGH FREQUENCY BAND
JESD-30 Code
R-CDFP-F2
R-PDFM-F2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
200 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
1
Factory Lead Time
28 Weeks
Samacsys Manufacturer
STMicroelectronics
Drain Current-Max (ID)
4 A
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Dissipation-Max (Abs)
74 W
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MRF182S with alternatives