MRF166W
vs
BLF245C
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
FLANGE MOUNT, R-CDFM-F4
|
FLANGE MOUNT, R-CDFM-F8
|
Pin Count |
4
|
|
Manufacturer Package Code |
CASE 412-01
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.75
|
8541.29.00.75
|
Case Connection |
SOURCE
|
ISOLATED
|
Configuration |
COMMON SOURCE, 2 ELEMENTS
|
COMMON SOURCE, 2 ELEMENTS
|
DS Breakdown Voltage-Min |
65 V
|
65 V
|
Drain Current-Max (ID) |
8 A
|
4.5 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
VERY HIGH FREQUENCY BAND
|
JESD-30 Code |
R-CDFM-F4
|
R-CDFM-F8
|
Number of Elements |
2
|
2
|
Number of Terminals |
4
|
8
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation Ambient-Max |
175 W
|
85 W
|
Power Gain-Min (Gp) |
11 dB
|
16 dB
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Drain-source On Resistance-Max |
|
1.5 Ω
|
Feedback Cap-Max (Crss) |
|
8 pF
|
|
|
|
Compare MRF166W with alternatives
Compare BLF245C with alternatives