MRF136 vs BLF245C feature comparison

MRF136 Motorola Mobility LLC

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BLF245C NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description FLANGE MOUNT, O-CRFM-F4 FLANGE MOUNT, R-CDFM-F8
Pin Count 4
Manufacturer Package Code CASE 211-07
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75 8541.29.00.75
Configuration SINGLE COMMON SOURCE, 2 ELEMENTS
DS Breakdown Voltage-Min 65 V 65 V
Drain Current-Max (ID) 2.5 A 4.5 A
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band ULTRA HIGH FREQUENCY BAND VERY HIGH FREQUENCY BAND
JESD-30 Code O-CRFM-F4 R-CDFM-F8
JESD-609 Code e0
Number of Elements 1 2
Number of Terminals 4 8
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 200 °C 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape ROUND RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation Ambient-Max 55 W 85 W
Power Gain-Min (Gp) 13 dB 16 dB
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form FLAT FLAT
Terminal Position RADIAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 2 1
Case Connection ISOLATED
Drain-source On Resistance-Max 1.5 Ω
Feedback Cap-Max (Crss) 8 pF

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