MR80C186-10
vs
TSX68C000ME1B/C10A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
LCC
|
LCC
|
| Package Description |
QCCN,
|
HQCCN,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
20
|
24
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
20 MHz
|
10 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-CQCC-N68
|
S-CQCC-N68
|
| Length |
24.13 mm
|
24.13 mm
|
| Low Power Mode |
YES
|
NO
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
5
|
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
68
|
68
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
HQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
3.68 mm
|
|
| Speed |
10 MHz
|
10 MHz
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.13 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
|
|
|
Compare MR80C186-10 with alternatives
Compare TSX68C000ME1B/C10A with alternatives