MR27T3202L-XXXLA vs M29W320DT70ZE1F feature comparison

MR27T3202L-XXXLA LAPIS Semiconductor Co Ltd

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M29W320DT70ZE1F Micron Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,32 FBGA, BGA48,6X8,32
Pin Count 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 70 ns
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA48,6X8,32 BGA48,6X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.00001 A 0.0001 A
Supply Current-Max 0.02 mA 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm
Base Number Matches 2 3
Rohs Code Yes
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 1,2,1,63
Ready/Busy YES
Sector Size 16K,8K,32K,64K
Toggle Bit YES

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