MQ80486DX475
vs
TS68040MF33
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
THOMSON-CSF SEMICONDUCTORS
|
Part Package Code |
QFP
|
QFP
|
Package Description |
GQFF, TPAK196,2.5SQ,25
|
,
|
Pin Count |
196
|
196
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
25 MHz
|
33 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
S-CQFP-F196
|
S-CQFP-G196
|
JESD-609 Code |
e0
|
|
Length |
34.29 mm
|
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
|
|
Number of External Interrupts |
3
|
|
Number of Serial I/Os |
|
|
Number of Terminals |
196
|
196
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
GQFF
|
|
Package Equivalence Code |
TPAK196,2.5SQ,25
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, GUARD RING
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
2.92 mm
|
|
Speed |
75 MHz
|
33 MHz
|
Supply Current-Max |
1100 mA
|
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
3.135 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Width |
34.29 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
4
|
|
|
|
Compare MQ80486DX475 with alternatives
Compare TS68040MF33 with alternatives