MQ1N3037AUR-1TR
vs
1SMA4757-GT3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
SANGDEST MICROELECTRONICS (NANJING) CO LTD
Part Package Code
DO-213AB
Package Description
O-LELF-R2
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AB
DO-214AC
JESD-30 Code
O-LELF-R2
R-PDSO-C2
JESD-609 Code
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.25 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
51 V
51 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
C BEND
Terminal Position
END
DUAL
Voltage Tol-Max
10%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MQ1N3037AUR-1TR with alternatives
Compare 1SMA4757-GT3 with alternatives