MPX5050GVS
vs
MPX5050DP
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
compliant
|
Accuracy-Max (%) |
2.5%
|
2.5%
|
Additional Feature |
TEMPERATURE COMPENSATED, SIGNAL CONDITIONED
|
SENSITIVITY 90 MILLI VOLT PER KILO PASCAL, TEMPERATURE COMPENSATED
|
Body Breadth |
20.31 mm
|
10.67 mm
|
Body Length or Diameter |
17.9 mm
|
29.46 mm
|
Housing |
PLASTIC
|
PLASTIC
|
Linearity (%) |
2.5 %
|
2.5 %
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Offset-Nom |
0.20V
|
0.20V
|
Operating Current-Max |
10 mA
|
10 mA
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Range |
0-40mV
|
0.20-4.70V
|
Output Type |
ANALOG VOLTAGE
|
ANALOG VOLTAGE
|
Package Shape/Style |
ROUND
|
RECTANGULAR
|
Port Type |
BARBED
|
BARBED
|
Pressure Range-Max |
7.25 Psi
|
7.25 Psi
|
Pressure Range-Min |
|
|
Pressure Sensing Mode |
GAGE
|
DIFFERENTIAL
|
Response Time |
1000 µs
|
1000 µs
|
Sensors/Transducers Type |
PRESSURE SENSOR,PIEZORESISTIVE
|
PRESSURE SENSOR,PIEZORESISTIVE
|
Supply Voltage-Max |
16 V
|
5.25 V
|
Supply Voltage-Min |
10 V
|
4.75 V
|
Surface Mount |
NO
|
NO
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Package Description |
|
PLASTIC, UNIBODY PACKAGE-6
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Factory Lead Time |
|
16 Weeks, 4 Days
|
Samacsys Manufacturer |
|
NXP
|
Body Height |
|
28.7 mm
|
|
|
|
Compare MPX5050GVS with alternatives
Compare MPX5050DP with alternatives