MPX5050DP
vs
MPX5050DP
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
compliant
|
| Accuracy-Max (%) |
2.5%
|
2.5%
|
| Additional Feature |
TEMPERATURE COMPENSATED, SIGNAL CONDITIONED
|
SENSITIVITY 90 MILLI VOLT PER KILO PASCAL, TEMPERATURE COMPENSATED
|
| Body Breadth |
10.67 mm
|
10.67 mm
|
| Body Height |
28.7 mm
|
28.7 mm
|
| Body Length or Diameter |
29.46 mm
|
29.46 mm
|
| Housing |
PLASTIC
|
PLASTIC
|
| JESD-609 Code |
e0
|
|
| Linearity (%) |
2.5 %
|
2.5 %
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Offset-Nom |
0.20V
|
0.20V
|
| Operating Current-Max |
10 mA
|
10 mA
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Range |
0-40mV
|
0.20-4.70V
|
| Output Type |
ANALOG VOLTAGE
|
ANALOG VOLTAGE
|
| Port Type |
BARBED
|
BARBED
|
| Pressure Range-Max |
7.25 Psi
|
7.25 Psi
|
| Pressure Range-Min |
|
|
| Pressure Sensing Mode |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Response Time |
1000 µs
|
1000 µs
|
| Sensors/Transducers Type |
PRESSURE SENSOR,PIEZORESISTIVE
|
PRESSURE SENSOR,PIEZORESISTIVE
|
| Supply Voltage-Max |
16 V
|
5.25 V
|
| Supply Voltage-Min |
10 V
|
4.75 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Package Description |
|
PLASTIC, UNIBODY PACKAGE-6
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
16 Weeks, 3 Days
|
| Samacsys Manufacturer |
|
NXP
|
| Package Shape/Style |
|
RECTANGULAR
|
|
|
|
Compare MPX5050DP with alternatives
Compare MPX5050DP with alternatives