MPSW56
vs
MPSW56RLRP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ONSEMI
|
| Package Description |
,
|
TO-226, 3 PIN
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Collector Current-Max (IC) |
0.5 A
|
0.5 A
|
| Configuration |
Single
|
SINGLE
|
| DC Current Gain-Min (hFE) |
80
|
50
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Polarity/Channel Type |
PNP
|
PNP
|
| Power Dissipation-Max (Abs) |
1 W
|
2.5 W
|
| Surface Mount |
NO
|
NO
|
| Transition Frequency-Nom (fT) |
50 MHz
|
50 MHz
|
| Base Number Matches |
7
|
4
|
| Part Package Code |
|
TO-92
|
| Pin Count |
|
3
|
| Manufacturer Package Code |
|
CASE 29-10
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.29.00.75
|
| Factory Lead Time |
|
4 Weeks
|
| Collector-Base Capacitance-Max |
|
15 pF
|
| Collector-Emitter Voltage-Max |
|
80 V
|
| JEDEC-95 Code |
|
TO-92
|
| JESD-30 Code |
|
O-PBCY-T3
|
| JESD-609 Code |
|
e0
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
ROUND
|
| Package Style |
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Power Dissipation Ambient-Max |
|
1 W
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
BOTTOM
|
| Transistor Application |
|
AMPLIFIER
|
| Transistor Element Material |
|
SILICON
|
| VCEsat-Max |
|
0.5 V
|
|
|
|
Compare MPSW56RLRP with alternatives