MPC93R52AC
vs
ASM3P623S00AG-08-TR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
ALLIANCE SEMICONDUCTOR CORP
|
| Part Package Code |
QFP
|
SOIC
|
| Package Description |
LQFP-32
|
TSSOP,
|
| Pin Count |
32
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
3
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Base Number Matches |
3
|
2
|
| Family |
|
3P
|
| Input Conditioning |
|
STANDARD
|
| JESD-30 Code |
|
R-PDSO-G8
|
| Length |
|
4.4 mm
|
| Logic IC Type |
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
|
8
|
| Number of True Outputs |
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Propagation Delay (tpd) |
|
0.35 ns
|
| Qualification Status |
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
|
0.25 ns
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
3 mm
|
|
|
|
Compare ASM3P623S00AG-08-TR with alternatives