MPC875VR133 vs HD6417750SBP200 feature comparison

MPC875VR133 Freescale Semiconductor

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HD6417750SBP200 Hitachi Ltd

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC HITACHI LTD
Part Package Code BGA BGA
Package Description LEAD FREE, PLASTIC, BGA-256 BGA-256
Pin Count 256 256
Reach Compliance Code compliant unknown
ECCN Code 5A002 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32 26
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1
Length 23 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm
Speed 133 MHz 200 MHz
Supply Voltage-Max 1.9 V 2.07 V
Supply Voltage-Min 1.7 V 1.8 V
Supply Voltage-Nom 1.8 V 1.95 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Clock Frequency-Max 67 MHz
Operating Temperature-Max 75 °C
Operating Temperature-Min -20 °C
Temperature Grade COMMERCIAL EXTENDED

Compare MPC875VR133 with alternatives

Compare HD6417750SBP200 with alternatives