MPC866PCVR100A vs TS(X)PC860MHVG40A3 feature comparison

MPC866PCVR100A Freescale Semiconductor

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TS(X)PC860MHVG40A3 Thales Group

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA BGA
Package Description LEAD FREE, PLASTIC, BGA-357 CERAMIC, BGA-357
Pin Count 357 357
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 40 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-CBGA-B357
JESD-609 Code e1
Length 25 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 357 357
Operating Temperature-Max 100 °C 110 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm
Speed 100 MHz 40 MHz
Supply Voltage-Max 1.9 V 3.465 V
Supply Voltage-Min 1.7 V 3.135 V
Supply Voltage-Nom 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 2

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