MPC860PZQ80D4R2 vs KMPC860ENZQ80D4 feature comparison

MPC860PZQ80D4R2 Freescale Semiconductor

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KMPC860ENZQ80D4 Freescale Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA357,19X19,50 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pin Count 357 357
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 5A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
JESD-609 Code e0 e0
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 357 357
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA357,19X19,50 BGA357,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 2.52 mm
Speed 80 MHz 80 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Samacsys Manufacturer NXP

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Compare KMPC860ENZQ80D4 with alternatives