MPC860ENZQ50D4R2
vs
XPC862DPZP50
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Part Package Code
BGA
Package Description
25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
BGA, BGA357,19X19,50
Pin Count
357
Reach Compliance Code
unknown
unknown
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
JESD-609 Code
e0
Length
25 mm
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
357
357
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.52 mm
2.05 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
3
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Operating Temperature-Min
Package Equivalence Code
BGA357,19X19,50
Technology
CMOS
Compare XPC862DPZP50 with alternatives