MPC860DEZQ66D4
vs
MPC860DTVR66D4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
Reach Compliance Code
unknown
compliant
ECCN Code
3A991
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
JESD-609 Code
e0
e1
Length
25 mm
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
357
357
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA357,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.52 mm
2.52 mm
Speed
66 MHz
66 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
357
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
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