MPC860DECVR50D4 vs MPC860DECZQ50D4 feature comparison

MPC860DECVR50D4 Freescale Semiconductor

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MPC860DECZQ50D4 Freescale Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pin Count 357 357
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
JESD-609 Code e1 e0
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Seated Height-Max 2.52 mm 2.52 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Operating Temperature-Min -40 °C
Package Equivalence Code BGA357,19X19,50
Qualification Status Not Qualified

Compare MPC860DECVR50D4 with alternatives

Compare MPC860DECZQ50D4 with alternatives