MPC860DECVR50D4 vs MPC855TVR50D4 feature comparison

MPC860DECVR50D4 Freescale Semiconductor

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MPC855TVR50D4 Freescale Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
Pin Count 357 357
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
JESD-609 Code e1 e1
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Seated Height-Max 2.52 mm 2.52 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Package Equivalence Code BGA357,19X19,50
Qualification Status Not Qualified

Compare MPC860DECVR50D4 with alternatives

Compare MPC855TVR50D4 with alternatives