MPC8572EVJARLE
vs
MPC8572EPXARLD
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
BGA,
|
33 X 33 MM, PLASTIC, FCBGA-1023
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
5A002.A.1
|
5A002.A
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
|
Address Bus Width |
16
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
133 MHz
|
External Data Bus Width |
64
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B1023
|
S-PBGA-B1023
|
JESD-609 Code |
e2
|
e0
|
Length |
33 mm
|
33 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
1023
|
1023
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Seated Height-Max |
3.38 mm
|
3.38 mm
|
Speed |
1067 MHz
|
1067 MHz
|
Supply Voltage-Max |
1.155 V
|
1.155 V
|
Supply Voltage-Min |
1.045 V
|
1.045 V
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Silver (Sn/Ag)
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
33 mm
|
33 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
1023
|
Package Equivalence Code |
|
BGA1023,32X32,40
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MPC8572EVJARLE with alternatives
Compare MPC8572EPXARLD with alternatives