MPC8572EVJARLE
vs
MC8641DHX1250HC
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
BGA,
|
33 X 33 MM, CERAMIC, BGA-1023
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
5A002.A.1
|
3A991
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
16
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
1250 MHz
|
| External Data Bus Width |
64
|
32
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B1023
|
S-CBGA-B1023
|
| JESD-609 Code |
e2
|
e0
|
| Length |
33 mm
|
33 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
1023
|
1023
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
225
|
| Seated Height-Max |
3.38 mm
|
2.97 mm
|
| Speed |
1067 MHz
|
166.66 MHz
|
| Supply Voltage-Max |
1.155 V
|
1.1 V
|
| Supply Voltage-Min |
1.045 V
|
1 V
|
| Supply Voltage-Nom |
1.1 V
|
1.05 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
33 mm
|
33 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
1023
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MPC8572EVJARLE with alternatives
Compare MC8641DHX1250HC with alternatives