MPC8569EVTANKGA vs MPC8569CVTANKGB feature comparison

MPC8569EVTANKGA Freescale Semiconductor

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MPC8569CVTANKGB Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783
Pin Count 783 783
Reach Compliance Code not_compliant not_compliant
ECCN Code 5A002 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 16
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 133 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B783 S-PBGA-B783
Length 29 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 783 783
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA783,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.94 mm 3.94 mm
Speed 800 MHz 800 MHz
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER OVER NICKEL TIN SILVER COPPER OVER NICKEL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature IT ALSO OPERATES IN 1.1V NOMINAL SUPPLY VOLTAGE

Compare MPC8569EVTANKGA with alternatives

Compare MPC8569CVTANKGB with alternatives