MPC8560VT667FB
vs
MPC8540PX833LB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
BGA,
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
5A991
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
2
2
Rohs Code
Part Package Code
BGA
Pin Count
783
Address Bus Width
64
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
166 MHz
External Data Bus Width
64
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B783
JESD-609 Code
e0
Length
29 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
783
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA783,28X28,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
3.85 mm
Speed
667 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
Compare MPC8560VT667FB with alternatives
Compare MPC8540PX833LB with alternatives