MPC8560PX667LB vs MPC8545PXANGA feature comparison

MPC8560PX667LB Freescale Semiconductor

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MPC8545PXANGA Freescale Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783 29 X 29 MM, 1 MM PITCH, PLASTIC, FCBGA-783
Pin Count 783 783
Reach Compliance Code not_compliant not_compliant
ECCN Code 5A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 64 64
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166 MHz 133 MHz
External Data Bus Width 64 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B783 S-PBGA-B783
JESD-609 Code e0 e0
Length 29 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 783 783
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA783,28X28,40 BGA783,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.75 mm 3.38 mm
Speed 667 MHz 800 MHz
Supply Voltage-Max 1.26 V 1.155 V
Supply Voltage-Min 1.14 V 1.045 V
Supply Voltage-Nom 1.2 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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