MPC8560CVT667JD
vs
MPC8540CVT667LC
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
783
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
5A991
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
64
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
166 MHz
|
|
External Data Bus Width |
64
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B783
|
|
Length |
29 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
783
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3.85 mm
|
|
Speed |
667 MHz
|
|
Supply Voltage-Max |
1.26 V
|
|
Supply Voltage-Min |
1.14 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
29 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MPC8560CVT667JD with alternatives
Compare MPC8540CVT667LC with alternatives