MPC8560CPXALFB vs MPC8560PX667LB feature comparison

MPC8560CPXALFB Freescale Semiconductor

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MPC8560PX667LB Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
Pin Count 783 783
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 5A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 64 64
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166 MHz 166 MHz
External Data Bus Width 64 64
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B783 S-PBGA-B783
Length 29 mm 29 mm
Low Power Mode YES YES
Number of Terminals 783 783
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.75 mm 3.75 mm
Speed 667 MHz 667 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Equivalence Code BGA783,28X28,40
Peak Reflow Temperature (Cel) 260
Temperature Grade OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8560CPXALFB with alternatives

Compare MPC8560PX667LB with alternatives