MPC8555EPXAKDX
vs
MPC8541EVTAKE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
BGA,
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
2
1
Rohs Code
Part Package Code
BGA
Pin Count
783
Address Bus Width
64
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
166 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B783
JESD-609 Code
e2
Length
29 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
783
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
HBGA
Package Equivalence Code
BGA783,28X28,40
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
3.75 mm
Speed
600 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver (Sn/Ag)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Compare MPC8555EPXAKDX with alternatives
Compare MPC8541EVTAKE with alternatives