MPC8555ECPXALDX
vs
MPC8555ECPXALF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
BGA,
BGA, BGA783,28X28,40
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
783
Address Bus Width
64
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
166 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B783
JESD-609 Code
e0
Length
29 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
783
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA783,28X28,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Seated Height-Max
3.75 mm
Speed
667 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Compare MPC8555ECPXALDX with alternatives
Compare MPC8555ECPXALF with alternatives