MPC8555ECPXAKF
vs
MPC8533ECVTANF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
BGA,
|
BGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
15
|
64
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
64
|
32
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
| Length |
29 mm
|
29 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
783
|
783
|
| Operating Temperature-Max |
105 °C
|
90 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.75 mm
|
2.8 mm
|
| Speed |
600 MHz
|
800 MHz
|
| Supply Voltage-Max |
1.26 V
|
1.05 V
|
| Supply Voltage-Min |
1.14 V
|
0.95 V
|
| Supply Voltage-Nom |
1.2 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
783
|
| ECCN Code |
|
3A991.A.2
|
| Clock Frequency-Max |
|
66 MHz
|
| JESD-609 Code |
|
e2
|
| Terminal Finish |
|
TIN SILVER
|
|
|
|
Compare MPC8555ECPXAKF with alternatives
Compare MPC8533ECVTANF with alternatives