MPC8555CVTALDX vs MPC8555CPXALEX feature comparison

MPC8555CVTALDX NXP Semiconductors

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MPC8555CPXALEX Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description BGA, BGA,
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Base Number Matches 2 2
Part Package Code BGA
Pin Count 783
Address Bus Width 64
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 166 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B783
Length 29 mm
Low Power Mode YES
Number of Terminals 783
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.75 mm
Speed 667 MHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Compare MPC8555CVTALDX with alternatives

Compare MPC8555CPXALEX with alternatives