MPC8555CVTAKEX
vs
MPC8541EVTAKE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
Pin Count
783
783
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
64
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166 MHz
166 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
Length
29 mm
29 mm
Low Power Mode
YES
YES
Number of Terminals
783
783
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.75 mm
3.75 mm
Speed
600 MHz
600 MHz
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Rohs Code
JESD-609 Code
e2
Moisture Sensitivity Level
3
Package Equivalence Code
BGA783,28X28,40
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s)
40
Compare MPC8555CVTAKEX with alternatives
Compare MPC8541EVTAKE with alternatives