MPC8555CPXAQEX
vs
MPC8555EPXAQF
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
BGA,
|
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.2
|
5A002
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
783
|
Samacsys Manufacturer |
|
NXP
|
Address Bus Width |
|
64
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
166 MHz
|
External Data Bus Width |
|
64
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-PBGA-B783
|
JESD-609 Code |
|
e0
|
Length |
|
29 mm
|
Low Power Mode |
|
YES
|
Moisture Sensitivity Level |
|
3
|
Number of Terminals |
|
783
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA783,28X28,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
|
245
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
3.75 mm
|
Speed |
|
1000 MHz
|
Supply Voltage-Max |
|
1.35 V
|
Supply Voltage-Min |
|
1.25 V
|
Supply Voltage-Nom |
|
1.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Terminal Finish |
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
Compare MPC8555CPXAQEX with alternatives
Compare MPC8555EPXAQF with alternatives