MPC8548VTAQGC
vs
PCX8548EVSHAQGB
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELEDYNE E2V (UK) LTD
|
| Package Description |
BGA,
|
BGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-PBGA-B783
|
S-CBGA-B783
|
| Length |
29 mm
|
29 mm
|
| Number of Terminals |
783
|
783
|
| Operating Temperature-Max |
105 °C
|
110 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA783,28X28,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
3.38 mm
|
3.38 mm
|
| Supply Voltage-Max |
1.155 V
|
1.155 V
|
| Supply Voltage-Min |
1.045 V
|
1.045 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
783
|
| ECCN Code |
|
3A991.A.2
|
| Address Bus Width |
|
64
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
133 MHz
|
| External Data Bus Width |
|
64
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
YES
|
| JESD-609 Code |
|
e1
|
| Low Power Mode |
|
YES
|
| Speed |
|
1000 MHz
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare MPC8548VTAQGC with alternatives
Compare PCX8548EVSHAQGB with alternatives