MPC8548ECVJAQJC vs MPC8548EPXAQJC feature comparison

MPC8548ECVJAQJC NXP Semiconductors

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MPC8548EPXAQJC NXP Semiconductors

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Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-PBGA-B783 S-PBGA-B783
Length 29 mm 29 mm
Number of Terminals 783 783
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA783,28X28,40 BGA783,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Seated Height-Max 3.38 mm 3.38 mm
Supply Voltage-Max 1.155 V 1.155 V
Supply Voltage-Min 1.045 V 1.045 V
Supply Voltage-Nom 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type SoC SoC
Base Number Matches 1 1

Compare MPC8548ECVJAQJC with alternatives

Compare MPC8548EPXAQJC with alternatives