MPC8548ECVJAQJC
vs
MPC8548ECVJAQJB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
Length
29 mm
29 mm
Number of Terminals
783
783
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA783,28X28,40
BGA783,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Seated Height-Max
3.38 mm
3.38 mm
Supply Voltage-Max
1.155 V
1.155 V
Supply Voltage-Min
1.045 V
1.045 V
Supply Voltage-Nom
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
SoC
SoC
Base Number Matches
1
1
Package Description
BGA,
Additional Feature
ALSO AVAILABLE IN BGA WITH STAMPED LID
Temperature Grade
INDUSTRIAL
Compare MPC8548ECVJAQJC with alternatives
Compare MPC8548ECVJAQJB with alternatives