MPC8548ECPXAQJB
vs
PCX8548EMVSHUAQJB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
TELEDYNE E2V (UK) LTD
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
783
783
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PBGA-B783
S-CBGA-B783
JESD-609 Code
e0
e1
Length
29 mm
29 mm
Number of Terminals
783
783
Operating Temperature-Max
105 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA783,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
3.38 mm
3.38 mm
Supply Voltage-Max
1.155 V
1.155 V
Supply Voltage-Min
1.045 V
1.045 V
Supply Voltage-Nom
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD SILVER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
SoC
MICROPROCESSOR
Base Number Matches
1
1
ECCN Code
3A991.A.2
Address Bus Width
64
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
133 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
Low Power Mode
YES
Speed
1000 MHz
Temperature Grade
MILITARY
Compare MPC8548ECPXAQJB with alternatives
Compare PCX8548EMVSHUAQJB with alternatives