MPC8541VTAQF
vs
MPC8541CVTAQE
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
|
HBGA,
|
| Pin Count |
783
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
5A992
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
64
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
166 MHz
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
R-PBGA-B783
|
|
| Length |
29 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
783
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HBGA
|
|
| Package Equivalence Code |
BGA783,28X28,40
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.75 mm
|
|
| Speed |
1000 MHz
|
|
| Supply Voltage-Max |
1.35 V
|
|
| Supply Voltage-Min |
1.25 V
|
|
| Supply Voltage-Nom |
1.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
29 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare MPC8541VTAQF with alternatives
Compare MPC8541CVTAQE with alternatives