MPC8541PXAPEX
vs
MPC8541VTAPFX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
LGA
LGA
Package Description
CGA,
CGA,
Pin Count
360
360
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
LOW POWER TAKEN FROM SLEEP MODE
LOW POWER TAKEN FROM SLEEP MODE
Address Bus Width
36
36
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
200 MHz
200 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-C360
S-CBGA-C360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
CGA
CGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
1.8 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.2 V
1.2 V
Supply Voltage-Min
1.1 V
1.1 V
Supply Voltage-Nom
1.15 V
1.15 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
C BEND
C BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare MPC8541PXAPEX with alternatives
Compare MPC8541VTAPFX with alternatives