MPC853TVR80
vs
XPC823ZT25
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
BGA
Package Description
BGA, BGA256,16X16,50
BGA,
Pin Count
256
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
26
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
23 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.35 mm
Speed
80 MHz
Supply Voltage-Max
1.9 V
3.6 V
Supply Voltage-Min
1.7 V
3 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Clock Frequency-Max
25 MHz
Operating Temperature-Max
70 °C
Operating Temperature-Min
Temperature Grade
COMMERCIAL
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