MPC8536BVTATHA
vs
MPC8555EVTAQEX
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
PGA
|
BGA
|
Package Description |
29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, FCBPGA-783
|
BGA,
|
Pin Count |
783
|
783
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
|
Address Bus Width |
32
|
64
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
166 MHz
|
External Data Bus Width |
32
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
JESD-609 Code |
e2
|
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
783
|
783
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA783,28X28,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.76 mm
|
3.75 mm
|
Speed |
1250 MHz
|
1000 MHz
|
Supply Voltage-Max |
1.05 V
|
1.35 V
|
Supply Voltage-Min |
0.95 V
|
1.25 V
|
Supply Voltage-Nom |
1 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Silver (Sn/Ag)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC8536BVTATHA with alternatives
Compare MPC8555EVTAQEX with alternatives