MPC8533CVTANG
vs
MPC8533CVTANJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
BGA,
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
64
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
JESD-609 Code
e2
e2
Length
29 mm
29 mm
Low Power Mode
YES
YES
Number of Terminals
783
783
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Seated Height-Max
2.8 mm
2.8 mm
Speed
800 MHz
800 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER
TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Part Package Code
BGA
Pin Count
783
Compare MPC8533CVTANG with alternatives
Compare MPC8533CVTANJ with alternatives