MPC852TZT66
vs
HMS30C7202
feature comparison
Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
Ihs Manufacturer |
MOTOROLA INC
|
MAGNACHIP SEMICONDUCTOR LTD
|
Package Description |
PLASTIC, BGA-256
|
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-256
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
Address Bus Width |
32
|
25
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
23 mm
|
17 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
95 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
1.4 mm
|
Speed |
66 MHz
|
82.944 MHz
|
Supply Voltage-Max |
1.9 V
|
2.7 V
|
Supply Voltage-Min |
1.7 V
|
2.3 V
|
Supply Voltage-Nom |
1.8 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
23 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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