MPC852TZT50 vs 79RC32V334-133BBI feature comparison

MPC852TZT50 Motorola Mobility LLC

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79RC32V334-133BBI Integrated Device Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA256,16X16,50 27 X 27 MM, PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66.67 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 23 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 95 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 3.5 mm
Speed 50 MHz 133 MHz
Supply Voltage-Max 1.9 V 3.465 V
Supply Voltage-Min 1.7 V 3.135 V
Supply Voltage-Nom 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 1
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Power Supplies 3.3 V
Supply Current-Max 630 mA
Terminal Finish Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) 20

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Compare 79RC32V334-133BBI with alternatives