MPC852TCZT66A vs 79RC32T365180BC feature comparison

MPC852TCZT66A NXP Semiconductors

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79RC32T365180BC Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Package Description PLASTIC, BGA-256 17 X 17 MM, MO-192, CABGA-256
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 90 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 23 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 1.7 mm
Speed 66 MHz 180 MHz
Supply Voltage-Max 1.9 V 2.625 V
Supply Voltage-Min 1.7 V 2.375 V
Supply Voltage-Nom 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Pbfree Code No
Part Package Code BGA
Pin Count 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL

Compare MPC852TCZT66A with alternatives

Compare 79RC32T365180BC with alternatives