MPC850SEZT66
vs
MPC853TVR80
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA256,16X16,50
Pin Count
256
256
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
R-PBGA-B256
S-PBGA-B256
Number of Terminals
256
256
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Length
23 mm
Low Power Mode
YES
Package Equivalence Code
BGA256,16X16,50
Seated Height-Max
2.54 mm
Speed
80 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Terminal Pitch
1.27 mm
Width
23 mm
Compare MPC850SEZT66 with alternatives
Compare MPC853TVR80 with alternatives