MPC850DEVR66BU
vs
IBM25PPC750CXEJQ5012T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
IBM MICROELECTRONICS
|
Package Description |
BGA-256
|
LBGA, BGA256,20X20,50
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
5A991
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
26
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
32
|
64
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
|
Length |
23 mm
|
27 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
95 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Seated Height-Max |
2.54 mm
|
1.666 mm
|
Speed |
66 MHz
|
500 MHz
|
Supply Voltage-Max |
3.6 V
|
1.9 V
|
Supply Voltage-Min |
3 V
|
1.7 V
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
Width |
23 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Clock Frequency-Max |
|
133 MHz
|
Package Equivalence Code |
|
BGA256,20X20,50
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MPC850DEVR66BU with alternatives
Compare IBM25PPC750CXEJQ5012T with alternatives