MPC8378EVRAJFA vs MPC8378ECVRALGA feature comparison

MPC8378EVRAJFA NXP Semiconductors

Buy Now Datasheet

MPC8378ECVRALGA NXP Semiconductors

Buy Now
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TEBGA-689 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-689
Reach Compliance Code compliant compliant
ECCN Code 5A002.A.1 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks 4 Weeks
Samacsys Manufacturer NXP NXP
Additional Feature ALSO REQUIRES 2.5V AND 3.3V SUPPLY ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width 32 15
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.66 MHz
External Data Bus Width 32 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B689 S-PBGA-B689
JESD-609 Code e2 e2
Length 31 mm 31 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 689 689
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Equivalence Code BGA689,29X29,40 BGA689,29X29,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.46 mm 2.46 mm
Speed 333 MHz 667 MHz
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 31 mm 31 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Temperature Grade AUTOMOTIVE

Compare MPC8378EVRAJFA with alternatives

Compare MPC8378ECVRALGA with alternatives