MPC8378ECVRALGA
vs
MPC8378ECVRAJGA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-689
BGA,
Reach Compliance Code
compliant
unknown
ECCN Code
5A002.A.1
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
15
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66.66 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B689
S-PBGA-B689
JESD-609 Code
e2
e2
Length
31 mm
31 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
689
689
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
BGA
Package Equivalence Code
BGA689,29X29,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
2.46 mm
Speed
667 MHz
400 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Tin/Silver (Sn/Ag)
TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
31 mm
31 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Compare MPC8378ECVRALGA with alternatives
Compare MPC8378ECVRAJGA with alternatives