MPC8378CVRAGDA
vs
MPC8377EVRAGDA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-689
31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689
Pin Count
689
689
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
15
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66.66 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B689
S-PBGA-B689
JESD-609 Code
e2
e2
Length
31 mm
31 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
689
689
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
BGA
Package Equivalence Code
BGA689,29X29,40
BGA689,29X29,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
2.46 mm
Speed
400 MHz
266 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
TIN SILVER
TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
31 mm
31 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Compare MPC8378CVRAGDA with alternatives
Compare MPC8377EVRAGDA with alternatives